SOLUTION POUR LA METALLISATION ELECTROCHIMIQUE DE MATERIAUX DIELECTRIQUES, PROCEDE DE METALLISATION ELECTROCHIMIQUE DE MATERIAUX DIELECTRIQUES AU MOYEN DE LADITE SOLUTION, ET MATERIAUX DIELECTRIQUES TRAITES CONFORMEMENT AUDIT PROCEDE

L'INVENTION CONCERNE L'ELECTROCHIMIE.LA SOLUTION FAISANT L'OBJET DE L'INVENTION EST DU TYPE CONTENANT UN SEL DE CUIVRE, UN SEL CONTENANT DU PHOSPHORE, UN AGENT STABILISANT ET DE L'EAU, ET EST CARACTERISEE EN CE QU'EN TANT QUE SEL CONTENANT DU PHOSPHORE ELLE RENFERME UN...

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1. Verfasser:	ALMAXUD MAGOMEDOVICH MAKKAEV, OLEG IVANOVICH LOMOVSKY, JURY IVANOVICH MIKHAILOV ET VLADIMIR VYACHESLAVOVICH BOLDYREV
Format:	Patent
Sprache:	fre
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Zusammenfassung:	L'INVENTION CONCERNE L'ELECTROCHIMIE.LA SOLUTION FAISANT L'OBJET DE L'INVENTION EST DU TYPE CONTENANT UN SEL DE CUIVRE, UN SEL CONTENANT DU PHOSPHORE, UN AGENT STABILISANT ET DE L'EAU, ET EST CARACTERISEE EN CE QU'EN TANT QUE SEL CONTENANT DU PHOSPHORE ELLE RENFERME UN SEL D'ACIDE HYPOPHOSPHOREUX. LA COMPOSITION DE LA SOLUTION EST LA SUIVANTE (GL):SEL DE CUIVRE, 35 A 350;SEL D'ACIDE HYPOPHOSPHOREUX, 35 A 400;AGENT DE STABILISATION, 0,004 A 250;EAU, JUSQU'A 1L.LA SOLUTION EN QUESTION PEUT ETRE UTILISEE NOTAMMENT POUR LA REALISATION D'UNE COUCHE CONDUCTRICE DE COURANT SUR LA SURFACE D'UN DIELECTRIQUE AVANT L'APPLICATION ELECTROCHIMIQUE D'UN REVETEMENT METALLIQUE, AUSSI BIEN FONCTIONNEL QUE DECORATIF, SUR LA SURFACE D'UN STRATIFIE A BASE DE TISSU DE VERRE. PCT No. PCT/SU80/00063 Sec. 371 Date Feb. 18, 1981 Sec. 102(e) Date Feb. 18, 1981 PCT Filed Apr. 25, 1980 PCT Pub. No. WO80/02570 PCT Pub. Date Nov. 27, 1980.A solution for electrochemical metallization of dielectrics comprising a salt of copper, a phosphorus-containing salt, a stabilizing agent and water which contains, as the phosphorus-containing salt, a salt of hypophosphorous acid, the components being employed in the following proportions, g/l: copper salt: 35 to 350 hypophosphorous acid salt: 35 to 400 stabilizing agent: 0.004 to 250 water: up to 1 liter. A process for electrochemical metallization of dielectrics involving preparation of the dielectric surface, formation of a current-conducting layer thereon, electrochemical building-up of a metal coating, characterized in that the dielectric surface activation and formation of a current-conducting layer on this surface are effected simultaneously by wetting the dielectric surface with the above-specified solution, followed by a heat-treatment at a temperature within the range of from 80 DEG to 350 DEG C.