Electroless copper plating soln. - giving copper deposit of bright metallic appearance and improved ductility

The plating soln. comprises 0.001-0.30 mol/1.Cu salt, 0.001-0.60 mole/1. complexing agent for Cu2+ ions 0.0005-0.75 mole/1. reducing agent to reduce Cu2+ ions, 0.05-2.0 mole/1. alkali hydroxide, and 0.001-1.0 g/1 of R7SO2 N(R')R(C2H4O)mH (in which R7 is 3-12C perfluoroalkyl, R is 1-12C alkylene...

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Bibliographische Detailangaben
1. Verfasser:	MASAHIRO OITA, HYOGO HIROHATA ET NOBUHIRO HAMASAKI
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The plating soln. comprises 0.001-0.30 mol/1.Cu salt, 0.001-0.60 mole/1. complexing agent for Cu2+ ions 0.0005-0.75 mole/1. reducing agent to reduce Cu2+ ions, 0.05-2.0 mole/1. alkali hydroxide, and 0.001-1.0 g/1 of R7SO2 N(R')R(C2H4O)mH (in which R7 is 3-12C perfluoroalkyl, R is 1-12C alkylene, R' is H or 1-10C alkyl and m is 1-15) The resultant copper layer is ductile and of improved appearance. The plating soln. is stabilised against spontaneous decomposition. In an example, a ductile bright metallic copper layer was deposited using a bath contg. CuNO3, EDTA, HCHO, NaOH, and fluorad FC g/1 (RTM), with the bath at pH 12.8, and 70 degrees C. Solutions de revêtement non électrolytique de cuivre. Ces solutions comprennent un sel de cuivre, un agent de complexation, un réducteur, un hydroxyde alcalin et un agent tensio-actif non ionique contenant un groupe perfluorocarboné aliphatique. La présente est particulièrement utile pour fournir des solutions de revêtement non électrolytique de cuivre, convenant à la production de dépôts de cuivre ayant une ductilité élevée et un bon aspect, à l'aide de solutions qui sont très stables même à temperature élevée.