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A gas knife cooling system for reflow soldering cools soldered articles by impinging a gas flow directly on the articles and as a result uses less cooling gas. A heater is associated with the cooling system to remove flux deposits. The cooling system is installed in the cooling section of a reflow s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FORMELLA, TAD, AVRAMESCU, SABI, BAILEY, JOEL BRAD
Format:	Patent
Sprache:	fin ; swe
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A gas knife cooling system for reflow soldering cools soldered articles by impinging a gas flow directly on the articles and as a result uses less cooling gas. A heater is associated with the cooling system to remove flux deposits. The cooling system is installed in the cooling section of a reflow soldering apparatus and comprises at least one gas knife to direct a gas stream at soldered products passing through the cooling section on a conveyor. A heater is associated with the gas knife which is activated for predetermined cleaning cycles to heat the gas knife to a temperature above flux vaporization temperature of flux deposits from the soldered products.