KONTAKTFOERSEDD GIVARE MED SKIKTSTRUKTUR SAMT FOERFARANDE FOER UTFOERANDE AV KONTAKTERINGEN

KONTAKTFOERSEDD GIVARE MED SKIKTSTRUKTUR SAMT FOERFARANDE FOER UTFOERANDE AV KONTAKTERINGEN

In a novel multilayer transducer (1') with bonded contacts and a method for fabricating the bonded contact areas (5') of the transducer, the contact areas (5') are formed on the side surface (7) of the transducer by metal deposition using laser-based deposition, sputter deposition or...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEHTO, ARI, LAHDENPERAE, JUHA, KUISMA, HEIKKI
Format: Patent
Sprache:fin
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:In a novel multilayer transducer (1') with bonded contacts and a method for fabricating the bonded contact areas (5') of the transducer, the contact areas (5') are formed on the side surface (7) of the transducer by metal deposition using laser-based deposition, sputter deposition or another suitable metallization method. By virtue of the fabrication method of the contact areas, the size of the transducer (1')can be reduced and the transducer (1') can be bonded to a circuit board using surface-mount technology.