FOERFARANDE OCH ANORDNING FOER BESTAEMNING AV STRUKTURBILDNINGSKINETIKEN FOER BINDEMEDEL
A method for monitoring structural changes in a binder in contact with a solid object, while the binder is curing. Conductivity measuring pick-ups are placed in the binder mass and at the boundary between the binder and the solid object. A low amplitude AC voltage is applied to each pick-up at a low...
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Patent |
Sprache: | fin |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A method for monitoring structural changes in a binder in contact with a solid object, while the binder is curing. Conductivity measuring pick-ups are placed in the binder mass and at the boundary between the binder and the solid object. A low amplitude AC voltage is applied to each pick-up at a low frequency, and the pick-up output signals are compared by a differential inductive bridge. The difference between the output signals is indicative of the extent of adhesion of the binder to the solid object. Preferably, only those components of the pick-up signals which are in phase with the applied AC voltage are employed for the comparison. |
---|