METHOD, INSERT AND APPARATUS FOR PROCESS CONTROL AND MONITORING OF THIN FILM DEPOSITION

A method for determining penetration depth of a thin film process precursor, comprising providing an insert (100), arranging the insert (100) to contact a substrate (200) to form a plurality of spaces (101) in between the insert (100) and the substrate (200), and feeding the precursor(s) into the fo...

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Hauptverfasser: MANNINEN, Ilkka, KALLIOMÄKI, Jesse
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creator MANNINEN, Ilkka
KALLIOMÄKI, Jesse
description A method for determining penetration depth of a thin film process precursor, comprising providing an insert (100), arranging the insert (100) to contact a substrate (200) to form a plurality of spaces (101) in between the insert (100) and the substrate (200), and feeding the precursor(s) into the formed spaces (101) to determine the penetration depth of the precursor. Menetelmä ohutkalvoprosessiprekursorin tunkeutumissyvyyden määrittämiseksi, joka käsittää tarjotaan insertti (100), järjestetään insertti (100) kontaktiin substraatin (200) kanssa monikollisen määrän tiloja (101) muodostamiseksi insertin (100) ja substraatin (200) väliin, ja syötetään prekursoria (prekursoreita) muodostettuihin tiloihin (101) prekursorin tunkeutumissyvyyden määrittämiseksi
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
METALLURGY
PHYSICS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TESTING
title METHOD, INSERT AND APPARATUS FOR PROCESS CONTROL AND MONITORING OF THIN FILM DEPOSITION
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