Improved heat dissipation in a LED lamp
The present invention relates to A LED lamp (100). The novel structure of the LED lamp (100) enables a miniaturized device with effective heat dissipation. LED lamp comprises a metal body (200) with a cylindric lumen, a printed circuit board (300) with a plurality of installation holes (310), a LED...
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| creator | Koskinen, Timo Justen, Jarmo |
| description | The present invention relates to A LED lamp (100). The novel structure of the LED lamp (100) enables a miniaturized device with effective heat dissipation. LED lamp comprises a metal body (200) with a cylindric lumen, a printed circuit board (300) with a plurality of installation holes (310), a LED (105) and wiring (101) providing energy to the LED and a multi-layer. The circular printed circuit board (300) is fitted within the cylindric lumen near the distal end of the metal body (200). The printed circuit board (300) is configured to facilitate effective dissipation of heat from the LED (105).
Keksintö liittyy LED lamppuun (100). LED lampun (100) uusi rakenne mahdollistaa miniatyyrilaitteen jossa on tehokas lämmönpoisto. LED lamppu käsittää metallirungon (200) jolla on lieriömäinen ontelo, piirilevyn (300) jossa on useita asennusreikiä (310), LEDin (105) ja johdotuksen (101) joka tuo energian LEDille. Pyöreä monikerroksinen piirilevy (300) joka on sovitettu lieriömäiseen onteloon metallirungon (200) distaalipäähän. Piirilevy on järjestetty helpottamaan tehokasta lämpöhäviötä LEDIstä (105). |
| format | Patent |
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Keksintö liittyy LED lamppuun (100). LED lampun (100) uusi rakenne mahdollistaa miniatyyrilaitteen jossa on tehokas lämmönpoisto. LED lamppu käsittää metallirungon (200) jolla on lieriömäinen ontelo, piirilevyn (300) jossa on useita asennusreikiä (310), LEDin (105) ja johdotuksen (101) joka tuo energian LEDille. Pyöreä monikerroksinen piirilevy (300) joka on sovitettu lieriömäiseen onteloon metallirungon (200) distaalipäähän. Piirilevy on järjestetty helpottamaan tehokasta lämpöhäviötä LEDIstä (105).</description><language>eng ; fin ; swe</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; WEAPONS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191129&DB=EPODOC&CC=FI&NR=128166B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191129&DB=EPODOC&CC=FI&NR=128166B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Koskinen, Timo</creatorcontrib><creatorcontrib>Justen, Jarmo</creatorcontrib><title>Improved heat dissipation in a LED lamp</title><description>The present invention relates to A LED lamp (100). The novel structure of the LED lamp (100) enables a miniaturized device with effective heat dissipation. LED lamp comprises a metal body (200) with a cylindric lumen, a printed circuit board (300) with a plurality of installation holes (310), a LED (105) and wiring (101) providing energy to the LED and a multi-layer. The circular printed circuit board (300) is fitted within the cylindric lumen near the distal end of the metal body (200). The printed circuit board (300) is configured to facilitate effective dissipation of heat from the LED (105).
Keksintö liittyy LED lamppuun (100). LED lampun (100) uusi rakenne mahdollistaa miniatyyrilaitteen jossa on tehokas lämmönpoisto. LED lamppu käsittää metallirungon (200) jolla on lieriömäinen ontelo, piirilevyn (300) jossa on useita asennusreikiä (310), LEDin (105) ja johdotuksen (101) joka tuo energian LEDille. Pyöreä monikerroksinen piirilevy (300) joka on sovitettu lieriömäiseen onteloon metallirungon (200) distaalipäähän. Piirilevy on järjestetty helpottamaan tehokasta lämpöhäviötä LEDIstä (105).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD3zC0oyi9LTVHISE0sUUjJLC7OLEgsyczPU8jMU0hU8HF1UchJzC3gYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXxbp6GRhaGZmZOTsaEVQAAvnwmYg</recordid><startdate>20191129</startdate><enddate>20191129</enddate><creator>Koskinen, Timo</creator><creator>Justen, Jarmo</creator><scope>EVB</scope></search><sort><creationdate>20191129</creationdate><title>Improved heat dissipation in a LED lamp</title><author>Koskinen, Timo ; Justen, Jarmo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FI128166BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fin ; swe</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Koskinen, Timo</creatorcontrib><creatorcontrib>Justen, Jarmo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Koskinen, Timo</au><au>Justen, Jarmo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Improved heat dissipation in a LED lamp</title><date>2019-11-29</date><risdate>2019</risdate><abstract>The present invention relates to A LED lamp (100). The novel structure of the LED lamp (100) enables a miniaturized device with effective heat dissipation. LED lamp comprises a metal body (200) with a cylindric lumen, a printed circuit board (300) with a plurality of installation holes (310), a LED (105) and wiring (101) providing energy to the LED and a multi-layer. The circular printed circuit board (300) is fitted within the cylindric lumen near the distal end of the metal body (200). The printed circuit board (300) is configured to facilitate effective dissipation of heat from the LED (105).
Keksintö liittyy LED lamppuun (100). LED lampun (100) uusi rakenne mahdollistaa miniatyyrilaitteen jossa on tehokas lämmönpoisto. LED lamppu käsittää metallirungon (200) jolla on lieriömäinen ontelo, piirilevyn (300) jossa on useita asennusreikiä (310), LEDin (105) ja johdotuksen (101) joka tuo energian LEDille. Pyöreä monikerroksinen piirilevy (300) joka on sovitettu lieriömäiseen onteloon metallirungon (200) distaalipäähän. Piirilevy on järjestetty helpottamaan tehokasta lämpöhäviötä LEDIstä (105).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fin ; swe |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | Improved heat dissipation in a LED lamp |
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