Contact-furnished pickup with layer structure and method for creation of the contact points

Contact-furnished pickup with layer structure and method for creation of the contact points

This publication describes a contact-furnished pickup 1' with layer structure and a method for creating the contacting of the pickup. According to the invention, the contacts 5' are formed on the side surface 7 of the pickup by utilisation of laser-based metallisation technique, by vaporis...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEHTO,ARI, KUISMA,HEIKKI, LAHDENPERAE,JUHA
Format: Patent
Sprache:eng ; fin ; swe
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:This publication describes a contact-furnished pickup 1' with layer structure and a method for creating the contacting of the pickup. According to the invention, the contacts 5' are formed on the side surface 7 of the pickup by utilisation of laser-based metallisation technique, by vaporisation, or by utilisation of another suitable deposition technique. As a result of the new method of contacting, the size of the pickup 1' can be reduced and the pickup 1' can be connected to a circuit card by utilisation of surface mounting technique.