Procedimiento para realizar una unión soldada por láser y material compuesto de componentes
La invención se refiere a un método para formar una unión soldada por láser, en el que dos piezas a unir (11; 11a, 12; 12a) se unen entre sí bajo el efecto de un rayo láser (1) en una zona de unión (30; 30a) para formar una soldadura (2), en la que una parte a unir (11; 11a) consiste en un material...
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| description | La invención se refiere a un método para formar una unión soldada por láser, en el que dos piezas a unir (11; 11a, 12; 12a) se unen entre sí bajo el efecto de un rayo láser (1) en una zona de unión (30; 30a) para formar una soldadura (2), en la que una parte a unir (11; 11a) consiste en un material transparente a la radiación láser y la otra parte a unir (12; 12a) consiste en un material absorbente al láser. radiación, y en el que las dos partes a unir (11; 11a, 12; 12a) forman un receptáculo (25; 25a; 25b) para un componente (13; 13a; 13b; 14) separado de las partes a unir (11). ; 11a, 12; 12a). (Traducción automática con Google Translate, sin valor legal)
The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a). |
| format | Patent |
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The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).</description><language>spa</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240321&DB=EPODOC&CC=ES&NR=2962790T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240321&DB=EPODOC&CC=ES&NR=2962790T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FAISS, Markus</creatorcontrib><title>Procedimiento para realizar una unión soldada por láser y material compuesto de componentes</title><description>La invención se refiere a un método para formar una unión soldada por láser, en el que dos piezas a unir (11; 11a, 12; 12a) se unen entre sí bajo el efecto de un rayo láser (1) en una zona de unión (30; 30a) para formar una soldadura (2), en la que una parte a unir (11; 11a) consiste en un material transparente a la radiación láser y la otra parte a unir (12; 12a) consiste en un material absorbente al láser. radiación, y en el que las dos partes a unir (11; 11a, 12; 12a) forman un receptáculo (25; 25a; 25b) para un componente (13; 13a; 13b; 14) separado de las partes a unir (11). ; 11a, 12; 12a). (Traducción automática con Google Translate, sin valor legal)
The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjEEKwjAQRbtxIeodxgMI0oLSdam4FMxWytB8IZBmwqRd6G08g0foxQziAVw8Pg8-b1ncLio9rBscwigUWZkU7N2TlabAGTe_AyXxli1TFCU_vxKUHjTwCHXsqZchTkg5YPEVCTmHtC4Wd_YJm9-uiu2pNc15hygdUuQeAWPXXsv6UB7rvTFV9c_nA-hzPm4</recordid><startdate>20240321</startdate><enddate>20240321</enddate><creator>FAISS, Markus</creator><scope>EVB</scope></search><sort><creationdate>20240321</creationdate><title>Procedimiento para realizar una unión soldada por láser y material compuesto de componentes</title><author>FAISS, Markus</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ES2962790TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>spa</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>FAISS, Markus</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FAISS, Markus</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Procedimiento para realizar una unión soldada por láser y material compuesto de componentes</title><date>2024-03-21</date><risdate>2024</risdate><abstract>La invención se refiere a un método para formar una unión soldada por láser, en el que dos piezas a unir (11; 11a, 12; 12a) se unen entre sí bajo el efecto de un rayo láser (1) en una zona de unión (30; 30a) para formar una soldadura (2), en la que una parte a unir (11; 11a) consiste en un material transparente a la radiación láser y la otra parte a unir (12; 12a) consiste en un material absorbente al láser. radiación, y en el que las dos partes a unir (11; 11a, 12; 12a) forman un receptáculo (25; 25a; 25b) para un componente (13; 13a; 13b; 14) separado de las partes a unir (11). ; 11a, 12; 12a). (Traducción automática con Google Translate, sin valor legal)
The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Procedimiento para realizar una unión soldada por láser y material compuesto de componentes |
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