Material de embalaje y proceso de fabricación del mismo
The present disclosure relates to a packaging material comprising a core material layer having an area radially extending from an edge of a hole in said core material layer, wherein said area has a linearly or non-linearly decreasing core material layer thickness towards the edge of the hole. The di...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | spa |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present disclosure relates to a packaging material comprising a core material layer having an area radially extending from an edge of a hole in said core material layer, wherein said area has a linearly or non-linearly decreasing core material layer thickness towards the edge of the hole. The disclosure further relates to a method for production of such a packaging material, and uses thereof. |
---|