Material de embalaje y proceso de fabricación del mismo

The present disclosure relates to a packaging material comprising a core material layer having an area radially extending from an edge of a hole in said core material layer, wherein said area has a linearly or non-linearly decreasing core material layer thickness towards the edge of the hole. The di...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BENKÖ, Gabor, MAMELI, Alberto, LASSON, Rolf, BERGMAN, Seppo
Format: Patent
Sprache:spa
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Beschreibung
Zusammenfassung:The present disclosure relates to a packaging material comprising a core material layer having an area radially extending from an edge of a hole in said core material layer, wherein said area has a linearly or non-linearly decreasing core material layer thickness towards the edge of the hole. The disclosure further relates to a method for production of such a packaging material, and uses thereof.