Dispositivo de mecanizado por láser y procedimiento para la fabricación de una superficie en una pieza bruta

The laser processing device for the production of a contour on a blank (27), comprises a laser, which produces the laser beam impulse (24), a deflection device (23) that straightens the laser beam impulse of the laser on point of impingement within a predetermined pulse area (55) on the blank, and a positioning device that guides a relative movement between the blank and the pulse surface, where the relative movement passes in relative movement direction along the edge to be produced and/or the surface. The laser processing device for the production of a contour on a blank (27), comprises a laser, which produces the laser beam impulse (24), a deflection device (23) that straightens the laser beam impulse of the laser on point of impingement within a predetermined pulse area (55) on the blank, and a positioning device that guides a relative movement between the blank and the pulse surface, where the relative movement passes in relative movement direction along the edge to be produced and/or the surface. The positioning device adjusts an inclination angle between the radiation direction of the laser beam impulse and a surface to be produced on the blank. The material part of the blank covering the edge and/or the surface to be produced is areawisely removed in coating layers running parallel to pulse area. The coating layers extend itself transverse to the surface to be produced in the blank. The positioning device changes the inclination angle during processing the blank. The inclination angle is pre-determined in dependent upon the material of the blank to be worn out in the positioning device. The blank comprises a cutting material layer that is arranged on a carrier layer and the material part extends itself over both layers. The positioning device adjusts a first inclination angle for applying the materials of the cutting material layer, and a second inclination angle for applying the materials of the carrier layer. The intensity of the laser impulse during applying the material of the cutting material layer is different than during the application of the material of the carrier layer. The cutting material layer is implemented as cutting element and the carrier layer is implemented as carrier element, where the cutting material layer and the carrier layer are detachably connected to each other. The sum of the inclination angle is 5-25[deg] . The deflection means arranges the laser beam impulse on the point of impingement provided along a pre-determined