Composición de resina de poliamida

Una composicion de resina de poliamida que comprende: un componente de resina que contiene una poliamida (X), obtenida mediante policondensacion en estado fundido de un componente de diamina, que contiene el 70 % en moles o mas de m-xililendiamina y un componente de acido dicarboxilico, que contiene el 70 % en moles o mas de un acido α,ω-dicarboxilico alifatico lineal, una sal metalica de acido graso que tiene de 10 a 50 atomos de carbono, y un aditivo (A), siendo el aditivo (A) un tensioactivo. A polyamide resin composition comprises a resin component containing a polyamide (X) and a fatty acid metallic salt having from 10 to 50 carbon atoms. The polyamide (X) is obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an ±,É-linear aliphatic dicarboxylic acid in the presence of a phosphorus atom-containing compound and an alkali metal compound (C), and contains the phosphorus atom-containing compound in a concentration of from 50 to 400 ppm in terms of the phosphorus atom. The polyamide (X) has a ratio represented by the expression: M1/M2 in which expression M1 represents the total molar number of the fatty acid metallic salt in the polyamide resin composition, and M2 represents the molar number of the phosphorus atom-containing compound used in the polycondensation for producing the polyamide (X) in the polyamide resin composition of from 0.05 to 0.5; and a ratio of (molar number of the alkali metal compound (C))/(molar number of the phosphorus atom-containing compound) of from 0.5 to 1.