Composición adhesiva para unir de forma estable esporas de hongos a la superficie de semillas de vegetales y método para la cuantificación de la capacidad de adhesión

Composición adhesiva para unir de forma estable esporas de hongos a la superficie de semillas de vegetales y método para la cuantificación de la capacidad de adhesión

The present invention relates to an adhesive composition for joining fungus spores to the surface of vegetable seeds in a stable manner characterized in that it comprises an aqueous solution of fermented maize liquor and/or soya protein hydrolysates. The present invention also relates to a method an...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CIRINO, VERONICA CRISTINA, BONINI, PAOLO
Format: Patent
Sprache:spa
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
AGRICULTURE
ANIMAL HUSBANDRY
BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES, AS HERBICIDES
CHEMISTRY
DYES
FISHING
FORESTRY
HUMAN NECESSITIES
HUNTING
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PEST REPELLANTS OR ATTRACTANTS
PLANT GROWTH REGULATORS
POLISHES
PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTSTHEREOF
TRAPPING
USE OF MATERIALS AS ADHESIVES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to an adhesive composition for joining fungus spores to the surface of vegetable seeds in a stable manner characterized in that it comprises an aqueous solution of fermented maize liquor and/or soya protein hydrolysates. The present invention also relates to a method and to the use of the same for quantifying the adhesion capacity by means of an indirect measurement in which fluorescent microspheres joined to the surface of seeds are quantified by means of the fluorescence microscopy technique. This method allows an indirect assessment of the adhesion of fungus spores to the surface of seeds in a simple manner and consequently allows the quality of the adhesive composition of the present invention to be assessed.