Procedimiento de depósito y de tratamiento de una capa delgada a base de plata

The process for treating continuous electroconductive thin layer deposited on a first face of a substrate such as silico-sodo-calcic glass, comprises altering each point of the thin layer to a temperature of >= 300[deg] C for 0.5 seconds, and increasing a crystallization rate of the thin layer to >= 50% by maintaining a temperature of = 50[deg] C at any point on the face of the substrate opposed to the first face and without melting of the thin layer. The substrate has a dimension of >= 2 m. The thin layer is heated by induction and projection technique using plasma torch. The process for treating continuous electroconductive thin layer deposited on a first face of a substrate such as silico-sodo-calcic glass, comprises altering each point of the thin layer to a temperature of >= 300[deg] C for 0.5 seconds, and increasing a crystallization rate of the thin layer to >= 50% by maintaining a temperature of = 50[deg] C at any point on the face of the substrate opposed to the first face and without melting of the thin layer. The substrate has a dimension of >= 2 m. The thin layer is heated by: induction; a projection technique using plasma torch; subjecting the thin layer to flame; and contacting with a hot solid and with radiation of which the wave length is comprised in a part of an infrared radiation absorbed by the layer. The thin layer is altered to a temperature of 300-800[deg] C, when it is based on anatase form titanium oxide. The thin layer is altered to a temperature of 350-550[deg] C, when it is based on silver. Independent claims are included for: (1) a process to obtain a material comprising a substrate and a thin layer; and (2) a susceptible material.