Dispositivo para el mecanizado preciso de material

The method involves providing laser pulses with a pulse length between 50 femto second and 1 pico second, with a pulse frequency from 50 kilo hertz and 1 mega hertz, and with a wavelength between 600 nanometer and 2000 nanometer for acting on a material e.g. eye, to be worked. The laser pulses are f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BISCHOFF, Mark Dr, BENDETT, Mark, GERLACH, Mario, MUEHLHOFF, Dirk
Format: Patent
Sprache:spa
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Beschreibung
Zusammenfassung:The method involves providing laser pulses with a pulse length between 50 femto second and 1 pico second, with a pulse frequency from 50 kilo hertz and 1 mega hertz, and with a wavelength between 600 nanometer and 2000 nanometer for acting on a material e.g. eye, to be worked. The laser pulses are focused on or in the material, and the focal points are guided such that a cohesive cut surface is generated in the material. An independent claim is also included for an apparatus for precise working of material.