CHIP SENSOR CON PARTICULAS NO METALICAS CONECTADAS QUE COMPRENDEN UN REVESTIMIENTO METALICO

Un chip que comprende un sustrato con al menos una superficie, opcionalmente dieléctrica, y, encima de dicha al menos una superficie, una capa de partículas que tienen un núcleo no metálico y un revestimiento fabricado a partir de un metal de transición o de una aleación de metales de transición, caracterizado porque cada núcleo no metálico, de media, forma un punto de contacto rodeado por metal con al menos otro núcleo no metálico y/o la superficie del sustrato. The invention provides a chip comprising a substrate with at least one surface and a layer of particles having a non-metallic core and a coating made of a transition metal or a transition metal alloy, characterized in that each non-metallic core, on average, forms a metal-surrounded contact point with at least one other non-metallic core and/or the substrate surface. The invention also provides a method for preparing a chip, comprising the steps of, adsorbing non-metallic particles on said surface of the substrate, and, subsequently, adsorbing colloids of a transition metal on said non-metallic particles to provide the shell made of a transition metal or a transition metal alloy, and a chip which is obtainable by said method. The chip can be employed in optical devices for the detection of analytes.