Conjuntos de chips semiconductores, procedimientos de fabricación de los mismos y componentes para los mismos

A semiconductor chip assembly has a semiconductor chip (8420) having a front surface, the front surface including a central region and a peripheral region surrounding the central region, the chip having central contacts (8431) disposed in the central region of the front surface, a dielectric element (8436) overlying the chip front surface, and a plurality of terminals carried by the dielectric element for interconnection to a substrate. The dielectric element has a hole (8480) encompassing the central contacts, at least some of the terminals (8448) are central contact terminals overlying the chip front surface, and a plurality of central contact leads (8450) extend between the central contacts and the central contact terminals, the central contact leads being connected to the central contacts (8431) in the hole.