METODO PARA APLICAR UNA RESINA FOTOSENSIBLE A UN SUSTRATO PARA USO EN LA FABRICACION DE PAPEL

LA INVENCION SE REFIERE A UN METODO DE APLICACION DE UNA RESINA CURABLE, P.EJ., UNA RESINA FOTOSENSIBLE, A UN SUSTRATO COMO UNA BANDA SIN FIN DE ESCURRIDO DE UNA INDUSTRIA PAPELERA. DICHO METODO COMPRENDE LAS FASES DE: PROPORCIONAR UN SUSTRATO; PROPORCIONAR UNA RESINA LIQUIDA CURABLE; PROPORCIONAR U...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TROKHAN, PAUL, DENNIS, POWERS, JOHN, ROBERT, MCFARLAND, JAMES, ROBERT, MILLER, JAMES, DANIEL, II, BOUTILIER, GLENN, DAVID
Format:	Patent
Sprache:	spa
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR FLEXIBLE SHEET MATERIAL NOT OTHERWISE PROVIDED FOR LAUNDERING METHODS OF PRODUCING PAPER THEREON PAPER-MAKING PAPER-MAKING MACHINES PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PRODUCTION OF CELLULOSE SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPRAYING OR ATOMISING IN GENERAL TEXTILES TRANSPORTING TREATMENT OF TEXTILES OR THE LIKE WALL, FLOOR OR LIKE COVERING MATERIALS, e.g. LINOLEUM,OILCLOTH, ARTIFICIAL LEATHER, ROOFING FELT, CONSISTING OF AFIBROUS WEB COATED WITH A LAYER OF MACROMOLECULARMATERIAL WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	LA INVENCION SE REFIERE A UN METODO DE APLICACION DE UNA RESINA CURABLE, P.EJ., UNA RESINA FOTOSENSIBLE, A UN SUSTRATO COMO UNA BANDA SIN FIN DE ESCURRIDO DE UNA INDUSTRIA PAPELERA. DICHO METODO COMPRENDE LAS FASES DE: PROPORCIONAR UN SUSTRATO; PROPORCIONAR UNA RESINA LIQUIDA CURABLE; PROPORCIONAR UN SEGUNDO MATERIAL, DISTINTO DE LA RESINA LIQUIDA CURABLE; APLICAR EL SEGUNDO MATERIAL AL SUSTRATO PARA RELLENAR AL MENOS ALGUNOS DE LOS HUECOS DEL SUSTRATO SITUADO ENTRE AMBAS SUPERFICIES DE DICHO SUSTRATO; APLICAR AL SUSTRATO LA RESINA CURABLE; CURAR AL MENOS PARCIALMENTE LA RESINA, PROPORCIONANDO UNA CAPA DE RESINA SOBRE EL SUSTRATO; Y ELIMINAR AL MENOS PARTE DEL SEGUNDO MATERIAL DEL SUSTRATO, EN DONDE AL MENOS PARTE DE ESTE SEGUNDO MATERIAL SE ELIMINA DEL SUSTRATO TRAS LA APLICACION DE LA RESINA CURABLE AL MISMO. The invention comprises a method for applying a curable resin, such as a photosensitive resin, to a substrate such as a papermaker's dewatering felt. The method comprises the steps of providing a substrate; providing a curable liquid resin; providing a second material different from the curable liquid resin; applying the second material to the substrate to occupy at least some of the voids in the substrate intermediate the first and second surfaces of the substrate; applying the curable resin to the substrate; curing at least some of the resin to provide a resin layer on the substrate; and removing at least some of the second material from the substrate, wherein at least some of the second material is removed from the substrate after applying the curable resin to the substrate.