Solar cell manufacture, comprises intercalating etched silicon substrate with boron and phosphorus and coating with silver paste by silkscreen printing
A silicon substrate is chemically etched and intercalated with boron and on one side only with phosphorus, before being metallised using an aluminum-free silkscreen printing silver paste. A method for making silicon solar cells comprises: (i) reducing the thickness of the starting substrate (blank)...
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Zusammenfassung: | A silicon substrate is chemically etched and intercalated with boron and on one side only with phosphorus, before being metallised using an aluminum-free silkscreen printing silver paste. A method for making silicon solar cells comprises: (i) reducing the thickness of the starting substrate (blank) by chemically etching the silicon; (ii) intercalating with boron; (iii) masking one side of the substrate and chemically etching the opposite side; (iv) intercalating with phosphorus; and (v) metallising both sides of the substrate with an aluminum-free silver paste by silkscreen printing.
A silicon substrate is chemically etched and intercalated with boron and on one side only with phosphorus, before being metallised using an aluminum-free silkscreen printing silver paste. A method for making silicon solar cells comprises: (i) reducing the thickness of the starting substrate (blank) by chemically etching the silicon (ii) intercalating with boron (iii) masking one side of the substrate and chemically etching the opposite side (iv) intercalating with phosphorus and (v) metallising both sides of the substrate with an aluminum-free silver paste by silkscreen printing. (Machine-translation by Google Translate, not legally binding)
Procedimiento para la fabricación de células solares de silicio, con estructura de campo retrodifusor, bajo espesor de base y metalización serigráfica. El procedimiento comprende reducir el espesor del substrato de partida (oblea) mediante un ataque químico al silicio, difundir boro, enmascarar una cara de la oblea, ataca químicamente la otra y difundir fósforo. Un ataque autocontrolado de la superficie del boro permite realizar contactos eléctricos poco agresivos. La metalización de ambas caras se efectúa por deposición de una pasta serigráfica de plata que no contiene aluminio. El procedimiento es compatible con texturados de las superficies, deposición de capas antirreflectantes y limpiezas de la oblea. El procedimiento es útil para fabricar células solares con elevada eficiencia de conversión luz/electricidad. |
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