DISPOSITIVO PARA EL RECUBRIMIENTO DE SUSTRATOS AL VACIO

LA INVENCION SE REFIERE A UN DISPOSITIVO PARA RECUBRIMIENTO DE SUBSTRATOS (14) EN VACIO, QUE SE COMPONE DE UNA FUENTE (2) DE CORRIENTE ALTERNA, QUE ESTA UNIDA CON DOS CATODOS (6,7) DISPUESTOS EN UNA CAMARA (15) DE RECUBRIMIENTO EVACUABLE, ACTUANDO CONJUNTAMENTE DE FORMA ELECTRICA CON OBJETIVOS, DE F...

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Bibliographische Detailangaben
Hauptverfasser:	TESCHNER, GOTZ, SZCZYRBOWSKI, JOACHIM
Format:	Patent
Sprache:	spa
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Zusammenfassung:	LA INVENCION SE REFIERE A UN DISPOSITIVO PARA RECUBRIMIENTO DE SUBSTRATOS (14) EN VACIO, QUE SE COMPONE DE UNA FUENTE (2) DE CORRIENTE ALTERNA, QUE ESTA UNIDA CON DOS CATODOS (6,7) DISPUESTOS EN UNA CAMARA (15) DE RECUBRIMIENTO EVACUABLE, ACTUANDO CONJUNTAMENTE DE FORMA ELECTRICA CON OBJETIVOS, DE FORMA QUE SE PRODUCE UNA PULVERIZACION EN LA DESCARGA DE GAS Y LAS PARTICULAS PULVERIZADAS SE CONDENSAN SOBRE EL SUBSTRATO (14). EN LA CAMARA (15) DE RECUBRIMIENTO ES APLICABLE UN GAS DE PROCESO, QUE SE DISPONE ENTRE LA FUENTE (2) DE CORRIENTE ALTERNA Y EL PAR (6,7) DE CATODO CON UNA RED (1), QUE ACTUA COMO FILTRO, Y SE CONFIGURA A PARTIR DE UN TRANSFORMADOR (3) Y OTRAS BOBINAS (5, 12, 13), ASI COMO CONDENSADORES (4, 8, 9, 10, 11), GARANTIZANDOSE UN PROCESO DE RECUBRIMIENTO ESTABLE. Apparatus for sputter coating substrates (14) consists of an alternating current source (2) connected to two cathodes (6,7) located in a coating chamber (15) capable of being evacuated. The cathodes are connected to targets whose sputtered particles are coated onto the substrate. A process gas is passed through the chamber. A network circuit (1) is located between the chamber and the current source and consists of a transformer (3), coils (5,12,13) and capacitors (4,8,9,10,11). The circuit operates in such a way that the cathode resistance and cathode power are at a point (A) which is slightly away from the max. power value (M).