MATERIAL ADHESIVO Y DE SELLADO

UN MATERIAL ADHESIVO Y DE ESTANQUEIDAD CONTIENE A) AL MENOS UN PREPOLIMERO REACTIVO QUE ES LIQUIDO A TEMPERATURA AMBIENTE Y B) AL MENOS UN OTRO COMPONENTE QUE ES SOLIDO A TEMPERATURA AMBIENTE, LIQUIDO A TEMPERATURAS LIGERAMENTE ELEVADAS Y AL MENOS INCOMPATIBLE PARCIALMENTE CON EL POLIMERO O LOS POLI...

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Bibliographische Detailangaben
Hauptverfasser:	PROEBSTER, MANFRED, SCHUMANN, MANFRED
Format:	Patent
Sprache:	spa
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	UN MATERIAL ADHESIVO Y DE ESTANQUEIDAD CONTIENE A) AL MENOS UN PREPOLIMERO REACTIVO QUE ES LIQUIDO A TEMPERATURA AMBIENTE Y B) AL MENOS UN OTRO COMPONENTE QUE ES SOLIDO A TEMPERATURA AMBIENTE, LIQUIDO A TEMPERATURAS LIGERAMENTE ELEVADAS Y AL MENOS INCOMPATIBLE PARCIALMENTE CON EL POLIMERO O LOS POLIMEROS LIQUIDOS. EL COMPONENTE B) ES LIQUIDO CON PREFERENCIA A UNA TEMPERATURA MAXIMA DE 50 Adhesives and sealants (I) are claimed, contg. (a) reactive prepolymer(s) which is/are liq. at room temp. and (b) other component(s) which is/are solid at room temp., liq. at a slightly higher temp. and at least partly incompatible with (a). Also claimed is a process for the prodn. of (I) by compounding at a temp. above the m.pt. of component (b).