FILAMENT CONTAINING POLYAMIDE (PA) POLYMER AND ITS USE FOR ADDITIVE MANUFACTURING

The present invention relates to a filament made of or comprising a polymer composition (P) which comprises at least 50.0 wt. % (based on the total weight of the polymer composition (P)) of at least one polyamide (PA) comprising the recurring units (RPA) and (R*PA): where n is 10 or 9; and wherein a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WARD, Christopher, BERTRAND, Arthur, BOSSENNEC, Véronique, JEOL, Stéphane
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention relates to a filament made of or comprising a polymer composition (P) which comprises at least 50.0 wt. % (based on the total weight of the polymer composition (P)) of at least one polyamide (PA) comprising the recurring units (RPA) and (R*PA): where n is 10 or 9; and wherein at least 30.0 mol.% of the moieties derived from 4,4'-diaminodicyclohexylmethane are in a trans/trans configuration, this proportion being based on the total number of moles of the moieties derived from 4,4'-diaminodicyclohexylmethane in the polyamide (PA).