ENVIRONMENT SENSOR AND METHOD FOR OPERATING AN ENVIRONMENT SENSOR
The invention relates to an environment sensor (100), comprising: - a MEMS element (10); - an ASIC element (20) electrically connected to the MEMS element (10) by means of at least two bonding wires (2a, 2b), wherein the ASIC element (20) has an evaluation circuit (40, 50, 60) which is designed to d...
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creator | SLOGSNAT, David MUSAZZI, Massimiliano KREUTZER, Joachim TANGREDI, Domenico SANTORO, Manuel Salvatore |
description | The invention relates to an environment sensor (100), comprising: - a MEMS element (10); - an ASIC element (20) electrically connected to the MEMS element (10) by means of at least two bonding wires (2a, 2b), wherein the ASIC element (20) has an evaluation circuit (40, 50, 60) which is designed to determine and evaluate a parasitic capacitance (Cp) between the at least two bonding wires (2a, 2b) connected to pads (3a, 3b) of the MEMS element (10) in order to detect a material deposit on the environment sensor (100). |
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- an ASIC element (20) electrically connected to the MEMS element (10) by means of at least two bonding wires (2a, 2b), wherein the ASIC element (20) has an evaluation circuit (40, 50, 60) which is designed to determine and evaluate a parasitic capacitance (Cp) between the at least two bonding wires (2a, 2b) connected to pads (3a, 3b) of the MEMS element (10) in order to detect a material deposit on the environment sensor (100).</description><language>eng ; fre ; ger</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICS ; TESTING ; TRANSPORTING</subject><creationdate>2025</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20250115&DB=EPODOC&CC=EP&NR=4490482A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20250115&DB=EPODOC&CC=EP&NR=4490482A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SLOGSNAT, David</creatorcontrib><creatorcontrib>MUSAZZI, Massimiliano</creatorcontrib><creatorcontrib>KREUTZER, Joachim</creatorcontrib><creatorcontrib>TANGREDI, Domenico</creatorcontrib><creatorcontrib>SANTORO, Manuel Salvatore</creatorcontrib><title>ENVIRONMENT SENSOR AND METHOD FOR OPERATING AN ENVIRONMENT SENSOR</title><description>The invention relates to an environment sensor (100), comprising: - a MEMS element (10); - an ASIC element (20) electrically connected to the MEMS element (10) by means of at least two bonding wires (2a, 2b), wherein the ASIC element (20) has an evaluation circuit (40, 50, 60) which is designed to determine and evaluate a parasitic capacitance (Cp) between the at least two bonding wires (2a, 2b) connected to pads (3a, 3b) of the MEMS element (10) in order to detect a material deposit on the environment sensor (100).</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2025</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB09QvzDPL383X1C1EIdvUL9g9ScPRzUfB1DfHwd1FwA3L9A1yDHEM8_dyBEgqYynkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxrgImJpYGJhZGjoTERSgCo1yrf</recordid><startdate>20250115</startdate><enddate>20250115</enddate><creator>SLOGSNAT, David</creator><creator>MUSAZZI, Massimiliano</creator><creator>KREUTZER, Joachim</creator><creator>TANGREDI, Domenico</creator><creator>SANTORO, Manuel Salvatore</creator><scope>EVB</scope></search><sort><creationdate>20250115</creationdate><title>ENVIRONMENT SENSOR AND METHOD FOR OPERATING AN ENVIRONMENT SENSOR</title><author>SLOGSNAT, David ; 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- an ASIC element (20) electrically connected to the MEMS element (10) by means of at least two bonding wires (2a, 2b), wherein the ASIC element (20) has an evaluation circuit (40, 50, 60) which is designed to determine and evaluate a parasitic capacitance (Cp) between the at least two bonding wires (2a, 2b) connected to pads (3a, 3b) of the MEMS element (10) in order to detect a material deposit on the environment sensor (100).</abstract><oa>free_for_read</oa></addata></record> |
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subjects | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS TESTING TRANSPORTING |
title | ENVIRONMENT SENSOR AND METHOD FOR OPERATING AN ENVIRONMENT SENSOR |
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