RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

The present invention relates to a resin composition containing (A) a thermosetting resin and (B) a copolymer resin containing a structural unit derived from an aromatic vinyl compound and a structural unit derived from an unsaturated aliphatic hydrocarbon, in which the component (B) contains a comp...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SATO Naoyoshi, AKEBI Ryuji, TANIGAWA Takao, FUKUI Masato, TAKEGUCHI Ayaka
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a resin composition containing (A) a thermosetting resin and (B) a copolymer resin containing a structural unit derived from an aromatic vinyl compound and a structural unit derived from an unsaturated aliphatic hydrocarbon, in which the component (B) contains a component (B 1) having a content of a structural unit derived from an aromatic vinyl compound of 25 to 60% by mass, and a component (B2) having a content of a structural unit derived from an aromatic vinyl compound of less than that of the component (B 1) on a mass basis, and the content of the component (B 1) in the resin composition is greater than the content of the component (B2) in the resin composition on a mass basis; and a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package using the resin composition.