WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

Techniques are described for electrically connecting printed circuit modules 110, 120 using wire bonding. A first printed circuit module 110 may have one or more bonding pads 150 electrically coupled with one or more electrical components of the first printed circuit module, and a second printed cir...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Liao, Guangxun, Bardagjy, Andrew Matthew
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Techniques are described for electrically connecting printed circuit modules 110, 120 using wire bonding. A first printed circuit module 110 may have one or more bonding pads 150 electrically coupled with one or more electrical components of the first printed circuit module, and a second printed circuit module 120 may have one or more bonding pads 150 electrically coupled with one or more electrical components 130 of the second printed circuit module 120. One or more wire bonds 140 may be used to electrically connect the one or more bonding pads of the first printed circuit module to the one or more bonding pads of the second printed circuit module. A protective structure may be used to cover at least a portion of the one or more wire bonds.