BONDED STRUCTURES

BONDED STRUCTURES

A bonded structure can include a carrier including a first conductive contact and a second conductive contact, a first singulated element including a third conductive contact directly bonded to the first conductive contact without an adhesive, and a second singulated element including a fourth condu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GUEVARA, Gabriel, Z, MIRKARIMI, Laura, Wills, UZOH, Cyprian, Emeka, FOUNTAIN, Gaius, Gillman, Jr, GAO, Guilian, BANG, Kyong-Mo, KATKAR, Rajesh, WORKMAN, Thomas, THEIL, Jeremy, Alfred
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A bonded structure can include a carrier including a first conductive contact and a second conductive contact, a first singulated element including a third conductive contact directly bonded to the first conductive contact without an adhesive, and a second singulated element including a fourth conductive contact directly bonded to the second conductive contact without an adhesive, wherein the first and second conductive contacts are spaced apart by a contact spacing of no more than 250 microns.