PICK-AND-PLACE APPARATUS WITH FORCE MEASUREMENT AND CORRESPONDING PICKING AND PLACING METHODS

According to an aspect of the present disclosure, a pick-and-place apparatus is provided for picking an electronic component from a first carrier and for placing the electronic component onto a second carrier. The apparatus comprises a pickup unit that is provided with a diffraction grating that com...

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Bibliographische Detailangaben
Hauptverfasser:	van der Veen, Gijs, Liu, Yazhao, Goosen, Johannes Frans Lodewijk
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PRINTED CIRCUITS TESTING
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Beschreibung
Zusammenfassung:	According to an aspect of the present disclosure, a pick-and-place apparatus is provided for picking an electronic component from a first carrier and for placing the electronic component onto a second carrier. The apparatus comprises a pickup unit that is provided with a diffraction grating that comprises a repetition, in a first direction, of a pattern unit. By impinging collimated light onto the diffraction grating, an n-th order light beam is generated. A change in length of the pickup unit in the first direction at a position of the diffraction grating can be determined based on the sensed n-th order light beam.