ORGANIC FILLER AND RESIN COMPOSITION COMPRISING SAME

the present disclosure relates to an organic filler and a resin composition including the same. Specifically, the present disclosure relates to an organic filler and a resin composition including the same, which is capable of improving extrudability, glossiness, and the like of an engineering plasti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HEO, Sung Ik, NAM, Gi Joon, SHIN, Jung In, SHIN, Ji Wook
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	the present disclosure relates to an organic filler and a resin composition including the same. Specifically, the present disclosure relates to an organic filler and a resin composition including the same, which is capable of improving extrudability, glossiness, and the like of an engineering plastic as an organic filler for engineering plastics while significantly reducing manufacturing costs.