BONDED LAMINATE AND ELECTRONIC DEVICE HOUSING

Provided is a technique that makes it possible to improve the joining strength between a metal material and a resin while facilitating a process of integrating the metal material and the resin. An adhesive laminate 10 of one aspect of the present invention includes a base material layer 30 including...

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Bibliographische Detailangaben
Hauptverfasser:	KONDOU, Yasufumi, ITO, Hiroshi, TOCHIHIRA, Jun
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Provided is a technique that makes it possible to improve the joining strength between a metal material and a resin while facilitating a process of integrating the metal material and the resin. An adhesive laminate 10 of one aspect of the present invention includes a base material layer 30 including a nonwoven fabric, and an adhesive layer 20 laminated on one main surface of the base material layer and including an adhesive having a glass transition temperature Tg of -40°C or more and 20°C or less. An adhesive-impregnated layer 32 impregnated with the adhesive is formed in a part of the base material layer 30 on a side adjacent to the adhesive layer 20. The base material layer 30 has a thickness of 10 to 100 µm. A portion 34 not impregnated with the adhesive in the base material layer 30 has a thickness of 5 to 50 µm. The adhesive-impregnated layer 32 in the base material layer 30 has a thickness of 5 to 95 µm. In addition, the adhesive layer 20 has a thickness of 5 to 60 µm.