METHOD OF METALLIZATION BY A NICKEL OR COBALT ALLOY FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES
A method of metallizing a semiconductor for the manufacture of three-dimensional semiconductor devices such as integrated circuits or storage memories. The metallization process includes a step of activating the surface, of a mineral oxide substrate with a noble metal, such as palladium, followed by...
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| creator | BERTHON, Hermine, Marie LAKHDARI, Amine THIAM, Mikailou |
| description | A method of metallizing a semiconductor for the manufacture of three-dimensional semiconductor devices such as integrated circuits or storage memories. The metallization process includes a step of activating the surface, of a mineral oxide substrate with a noble metal, such as palladium, followed by a step of depositing a nickel or cobalt alloy containing boron and at least one of phosphorus and tungsten by electroless deposition. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4476382A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4476382A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4476382A13</originalsourceid><addsrcrecordid>eNqNzDEKwkAQBdA0FqLeYS5goQlqO5nMksXNjiQTITYxyFqJBuL9cQUPYPU_n8efJ9eKtZQCxEBs6Jy9oFrxkHeA4C0d2YHUQJKjU4hAOjBx0JKhQt8aJG1r_h40XFkSX7SkERR8tsTNMpndh8cUVr9cJGBYqVyH8dWHaRxu4RnePZ-ybL9LD1vcpH-QD-ugMsk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF METALLIZATION BY A NICKEL OR COBALT ALLOY FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES</title><source>esp@cenet</source><creator>BERTHON, Hermine, Marie ; LAKHDARI, Amine ; THIAM, Mikailou</creator><creatorcontrib>BERTHON, Hermine, Marie ; LAKHDARI, Amine ; THIAM, Mikailou</creatorcontrib><description>A method of metallizing a semiconductor for the manufacture of three-dimensional semiconductor devices such as integrated circuits or storage memories. The metallization process includes a step of activating the surface, of a mineral oxide substrate with a noble metal, such as palladium, followed by a step of depositing a nickel or cobalt alloy containing boron and at least one of phosphorus and tungsten by electroless deposition.</description><language>eng ; fre ; ger</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241218&DB=EPODOC&CC=EP&NR=4476382A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241218&DB=EPODOC&CC=EP&NR=4476382A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BERTHON, Hermine, Marie</creatorcontrib><creatorcontrib>LAKHDARI, Amine</creatorcontrib><creatorcontrib>THIAM, Mikailou</creatorcontrib><title>METHOD OF METALLIZATION BY A NICKEL OR COBALT ALLOY FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES</title><description>A method of metallizing a semiconductor for the manufacture of three-dimensional semiconductor devices such as integrated circuits or storage memories. The metallization process includes a step of activating the surface, of a mineral oxide substrate with a noble metal, such as palladium, followed by a step of depositing a nickel or cobalt alloy containing boron and at least one of phosphorus and tungsten by electroless deposition.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzDEKwkAQBdA0FqLeYS5goQlqO5nMksXNjiQTITYxyFqJBuL9cQUPYPU_n8efJ9eKtZQCxEBs6Jy9oFrxkHeA4C0d2YHUQJKjU4hAOjBx0JKhQt8aJG1r_h40XFkSX7SkERR8tsTNMpndh8cUVr9cJGBYqVyH8dWHaRxu4RnePZ-ybL9LD1vcpH-QD-ugMsk</recordid><startdate>20241218</startdate><enddate>20241218</enddate><creator>BERTHON, Hermine, Marie</creator><creator>LAKHDARI, Amine</creator><creator>THIAM, Mikailou</creator><scope>EVB</scope></search><sort><creationdate>20241218</creationdate><title>METHOD OF METALLIZATION BY A NICKEL OR COBALT ALLOY FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES</title><author>BERTHON, Hermine, Marie ; LAKHDARI, Amine ; THIAM, Mikailou</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4476382A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>BERTHON, Hermine, Marie</creatorcontrib><creatorcontrib>LAKHDARI, Amine</creatorcontrib><creatorcontrib>THIAM, Mikailou</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BERTHON, Hermine, Marie</au><au>LAKHDARI, Amine</au><au>THIAM, Mikailou</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF METALLIZATION BY A NICKEL OR COBALT ALLOY FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES</title><date>2024-12-18</date><risdate>2024</risdate><abstract>A method of metallizing a semiconductor for the manufacture of three-dimensional semiconductor devices such as integrated circuits or storage memories. The metallization process includes a step of activating the surface, of a mineral oxide substrate with a noble metal, such as palladium, followed by a step of depositing a nickel or cobalt alloy containing boron and at least one of phosphorus and tungsten by electroless deposition.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | METHOD OF METALLIZATION BY A NICKEL OR COBALT ALLOY FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES |
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