PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

Disclosed is a packaged semiconductor device having first and second major surfaces and comprising, a semiconductor die; conductive epoxy in contact with a surface of the semiconductor die, and exposed in a central region of the first major surface; a plurality of studs around a peripheral region of the first major surface; wire bonds between the semiconductor die and a surface of the studs which is remote from the first major surface, the wire bonds providing electrical connections between the semiconductor die and the plurality of studs; and encapsulant defining the second major surface and sidewalls of the packaged semiconductor device, wherein the first major surface is defined by the conductive epoxy, the encapsulant, and the studs.