METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE

A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter, wherein the matrix material is configured to cure when heated to a defined temperature for a defined period of time, and wherein the adhesion promoter is configure...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WIESEMANN, Markus, JÄGER, Fabian, TROSKA, Georg, HERZER, Anita
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter, wherein the matrix material is configured to cure when heated to a defined temperature for a defined period of time, and wherein the adhesion promoter is configured to be activated when heated to a temperature that is higher than the defined temperature and/or for a period of time that is longer than the defined period of time, and heating the first material to the defined temperature for the defined period of time such that the matrix material cures and the adhesion promoter remains inactive, thereby forming a pre-seal.