TEMPERATURE ADJUSTMENT MODULE

A temperature adjustment module (100, 200) is provided. The temperature adjustment module (100, 200) includes a temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) and a temperature control module (110, 210, 510, 610, 1011, 1012, 1111, 1112). The temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) includes a temperature changing area (701-709, 801-804, 901-904). The temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) is in contact with a peripheral circuit element (302-304, 501, 601) on a motherboard through the temperature changing area (701-709, 801-804, 901-904) and a heat conduction material (502, 602). The temperature control module (110, 210, 510, 610, 1011, 1012, 1111, 1112) is electrically connected to the temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) and configured to control a temperature of the temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) to reach a target temperature. The temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) further includes a printed circuit board in the temperature changing area (701-709, 801-804, 901-904), and the temperature of the temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) is changed by at least one of a winding wire or an electronic component on the printed circuit board.