LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS

A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein the aliphatic epoxy compound (A) comprises a compound repres...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE, Hidetoshi, TAKAHASHI, Hisato, KAMIMURA, Tsuyoshi, YOSHII, Haruyuki, MATSUZAKI, Takayuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein the aliphatic epoxy compound (A) comprises a compound represented by the following Formula (I):wherein, in Formula (I), n is an integer from 1 to 15, andwherein a percentage content of the aliphatic epoxy compound (A) is from 3% by mass to 40% by mass with respect to a total amount of compounds having an epoxy group.