MICROWAVE PLASMA APPARATUS AND METHODS FOR PROCESSING FEED MATERIAL UTIZILING MULTIPLE MICROWAVE PLASMA APPLICATORS

The embodiments disclosed herein are directed to systems and devices which utilize multiple microwave plasmas can be used to increase the efficiency of traditional single microwave plasma systems. Disclosed herein is a microwave plasma apparatus for processing materials which includes a reaction cha...

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Bibliographische Detailangaben
Hauptverfasser:	HOLMAN, Richard, K, KOZLOWSKI, Michael, C, ULLAL, Saurabh, COLWELL, John
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SOLDERING OR UNSOLDERING THEIR RELEVANT APPARATUS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The embodiments disclosed herein are directed to systems and devices which utilize multiple microwave plasmas can be used to increase the efficiency of traditional single microwave plasma systems. Disclosed herein is a microwave plasma apparatus for processing materials which includes a reaction chamber, a plurality of microwave plasma applicators in communication with the reaction chamber, one or more microwave radiation sources, at least one waveguide for guiding microwave radiation from the one or more microwave radiations sources to multiple plasma applicators, and a material feeding system in communication with the reaction chamber.