UNSTRETCHED FILM, MULTILAYER BODY AND PACKAGE

The present invention relates to a non-oriented film, a laminated body, and a package; the non-oriented film has a sealant layer composed of a resin composition including 30 to 90 mass% of a propylene-based polymer (A) and 10 to 70 mass% of a 1-butene/α-olefin copolymer (B), and a substrate layer; t...

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Bibliographische Detailangaben
Hauptverfasser:	EGAWA Makoto, KAMIYA Nozomi, HOYA Hiroshi, MIZUMA Takahiro, KAI Yuki, SHIOZAKI Nao
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a non-oriented film, a laminated body, and a package; the non-oriented film has a sealant layer composed of a resin composition including 30 to 90 mass% of a propylene-based polymer (A) and 10 to 70 mass% of a 1-butene/α-olefin copolymer (B), and a substrate layer; the propylene-based polymer (A) has a melting point (Tm) measured by differential scanning calorimetry (DSC) of 120°C or higher and 135°C or lower, and contains 50 to 90 mol% of a propylene-derived constitutional unit; the copolymer (B) has a melting point measured by DSC of lower than 120°C or has no melting point observed by DSC, and contains 50 to 99 mol% of a 1-butene-derived constitutional unit and 1 to 50 mol% of an α-olefin-derived constitutional unit (provided that a total of the 1-butene-derived constitutional unit and the α-olefin-derived constitutional unit is 100 mol%), the sealant layer has a thickness of 3 to 30 um, and the substrate layer has a thickness of 10 to 100 um.