LASER PROCESSING MACHINE, LASER PROCESSING METHOD, AND LASER PROCESSING PROGRAM

Provided is a laser processing machine configured to engrave, in a surface of a workpiece, a matrix-type two-dimensional code in which a first cell as a unit irradiation area and a second cell as a unit non-irradiation area are arranged in a desired array pattern in a first direction and a second di...

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Bibliographische Detailangaben
1. Verfasser:	HARUMIYA Bunyou
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a laser processing machine configured to engrave, in a surface of a workpiece, a matrix-type two-dimensional code in which a first cell as a unit irradiation area and a second cell as a unit non-irradiation area are arranged in a desired array pattern in a first direction and a second direction orthogonal to the first direction, the laser processing machine being provided with a laser processing head configured to irradiate the workpiece with a laser beam and a control unit configured to control the laser processing head, wherein the control unit includes a processing pattern selection unit, and the processing pattern selection unit is configured to select a tentative processing pattern from a plurality of processing patterns of the matrix-type two-dimensional code on a basis of a selection condition.