ALUMINUM-CONTAINING THERMAL PASTES

The present invention relates to a cross-linkable, thermally conductive silicone composition (Y) containing 5 - 50 vol.% of a cross-linkable silicone composition (S) and 50 - 95 vol. % of at least one thermally conductive filler (Z) having a thermal conductivity of at least 5 W/mK, with the proviso that the cross-linkable, thermally conductive silicone composition (Y) has a thermal conductivity of at least 0.6 W/mK, and that at least 20 vol.% of metallic aluminum particles are included as thermally conductive fillers (Z) which satisfy the following features: a) their mean diameter x50 is in the range of 30 - 150 µm; b) they are produced in the last process step by way of a melting process and have a predominantly rounded surface shape; and c) their distribution width SPAN ((x90-x10)/x50) is at least 0.40. The invention also relates to the production thereof and to the use thereof.