COMPOSITIONS, SYSTEMS, AND METHODS FOR TREATING A SUBSTRATE

Disclosed herein is a pretreatment composition comprising a lanthanide series metal; an oxidizing agent; and a fluorometallic acid, an organophosphate compound, an organophosphonate compound, or combinations thereof. Also disclosed is a pretreatment composition comprising a lanthanide series metal;...

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Bibliographische Detailangaben
Hauptverfasser:	KUMAR, Kuldeep, ALLEN, Kristi Maree, HARRIS, Rachel Dory, NOTTE, Anthony John, BROWN-TSENG, Elizabeth Stephenie, MCMILLEN, Mark William, BEZER, Silvia
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Disclosed herein is a pretreatment composition comprising a lanthanide series metal; an oxidizing agent; and a fluorometallic acid, an organophosphate compound, an organophosphonate compound, or combinations thereof. Also disclosed is a pretreatment composition comprising a lanthanide series metal; a carboxylic acid; and an oxidizing agent in an amount of no more than 70 ppm based on total weight of the pretreatment composition. Also disclosed is a system for treating a substrate comprising a cleaning composition and one of the pretreatment compositions disclosed herein. Also disclosed are methods of treating a substrate comprising contacting at least a portion of the substrate with one of the pretreatment compositions disclosed herein. Also disclosed are substrates comprising a surface having a film on at least a portion thereof, wherein the film is formed from one of the pretreatment compositions disclosed herein. Also disclosed are substrates treated with any of the systems or methods described herein.