HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING HEAT DISSIPATING STRUCTURE

An electronic apparatus according to various embodiments disclosed herein may comprise: a printed circuit board; an electronic component disposed on the printed circuit board; a shield can that is disposed on the printed circuit board and includes an opening facing at least a portion of the electronic component; a support structure that is disposed between the printed circuit board and the shield can and supports the shield can; a contact member that is at least partially located in the opening and covers a portion of the electronic component; a sheet member that includes a first region corresponding to the opening and a second region other than the first region and covers the contact member and the shield can; a first heat transfer member disposed on the sheet member; a second heat transfer member disposed on the sheet member and spaced apart from the first heat transfer member; a cover member covering the first heat transfer member and the second heat transfer member; and a protrusion part that overlaps the second region of the sheet member when viewed in the direction of the printed circuit board from the cover member.