WAVINESS PREDICTION DEVICE, WAVINESS PREDICTION METHOD, PROCESSING METHOD FOR POLISHING TARGET ARTICLE, AND PROGRAM

Occurrence of waviness abnormality is predicted. A waviness prediction device includes a data input part configured to receive an input of waviness data obtained by measuring waviness of a polishing target surface that is polished by rotating a polishing pad with a planetary gear mechanism; a featur...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO, Shuki, OKUNO, Yoshishige, TOGO, Yusuke, NARISAWA, Motoyuki, TAKEMOTO, Shimpei
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Occurrence of waviness abnormality is predicted. A waviness prediction device includes a data input part configured to receive an input of waviness data obtained by measuring waviness of a polishing target surface that is polished by rotating a polishing pad with a planetary gear mechanism; a feature obtainment part configured to obtain a feature including both a number of processed polishing targets in the polishing pad, and a torque of a sun gear; and a waviness prediction part configured to predict the waviness by inputting the feature obtained by the feature obtainment part to a prediction model that learns a relationship between the feature and the waviness data.