BONDING SHEET, METHOD FOR PRODUCING BONDING SHEET, AND METHOD FOR PRODUCING BONDED BODY
To appropriately perform bonding while suppressing the fear of breakage. A bonding sheet (10) includes a sintered body of copper, and has a Young's modulus of 10 GPa or more and a filling rate of 50% or more and 70% or less.
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | To appropriately perform bonding while suppressing the fear of breakage. A bonding sheet (10) includes a sintered body of copper, and has a Young's modulus of 10 GPa or more and a filling rate of 50% or more and 70% or less. |
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