BONDING SHEET, METHOD FOR PRODUCING BONDING SHEET, AND METHOD FOR PRODUCING BONDED BODY

To appropriately perform bonding while suppressing the fear of breakage. A bonding sheet (10) includes a sintered body of copper, and has a Young's modulus of 10 GPa or more and a filling rate of 50% or more and 70% or less.

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Bibliographische Detailangaben
Hauptverfasser: NAKAYA, Kiyotaka, MASUYAMA, Kotaro
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:To appropriately perform bonding while suppressing the fear of breakage. A bonding sheet (10) includes a sintered body of copper, and has a Young's modulus of 10 GPa or more and a filling rate of 50% or more and 70% or less.