THERMOELECTRIC COOLING FOR DIE PACKAGES

In some aspects, the disclosed technology provides microelectronic devices which can effectively dissipate heat and methods of forming the disclosed microelectronic devices. In some embodiments, a disclosed device may include a first integrated device die. The disclosed device may further include a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HABA, Belgacem, SHEN, Hong, KATKAR, Rajesh, VARIOT, Patrick
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	In some aspects, the disclosed technology provides microelectronic devices which can effectively dissipate heat and methods of forming the disclosed microelectronic devices. In some embodiments, a disclosed device may include a first integrated device die. The disclosed device may further include a thermoelectric element bonded to the first integrated device die. The disclosed device may further include a heat sink disposed over at least the thermoelectric element. The thermoelectric element may be configured to transfer heat from the first integrated device die to the heat sink. The thermoelectric element directly may be bonded to the first integrated device die without an adhesive.