MEASUREMENT METHOD AND APPARATUS FOR SEMICONDUCTOR FEATURES WITH INCREASED THROUGHPUT

A system and a method for measuring of parameter values of semiconductor objects within wafers with increased throughput is provided. The measuring method utilizes a modified machine learning algorithm to extract measurement results from instances of semiconductor objects. A training method for trai...

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Bibliographische Detailangaben
Hauptverfasser:	KORB, Thomas, NEUMANN, Jens Timo, KLOCHKOV, Dmitry, BUXBAUM, Alex, AVISHAI, Amir, PERSCH, Johannes, FOCA, Eugen, FREYTAG, Alexander, MALKI, Oliver
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CALCULATING CINEMATOGRAPHY COMPUTING COUNTING ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY ELECTROGRAPHY HOLOGRAPHY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	A system and a method for measuring of parameter values of semiconductor objects within wafers with increased throughput is provided. The measuring method utilizes a modified machine learning algorithm to extract measurement results from instances of semiconductor objects. A training method for training the modified machine learning algorithm is provided, in which a user interaction is reduced to a minimum. The method is more flexible and robust and requires less user interaction than conventional methods. The system and method can be used for quantitative metrology of integrated circuits within semiconductor wafers.