PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

A Printed Circuit Board, PCB, comprising: a first thermal pad (308) on a first side of the PCB for a first integrated circuit (102), IC, having a first exposed pad; a second thermal pad (304) on a second side of the PCB for a second integrated circuit (106), IC, having a second exposed pad, wherein...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JIANU, Ionut-Liviu, BARBALATA, Vlad-Alexandru, CRACIUN, Liviu-Dumitru, KRAFT, Günther, BILIGA-NISIPEANU, Paul-Alexandru
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A Printed Circuit Board, PCB, comprising: a first thermal pad (308) on a first side of the PCB for a first integrated circuit (102), IC, having a first exposed pad; a second thermal pad (304) on a second side of the PCB for a second integrated circuit (106), IC, having a second exposed pad, wherein the first thermal pad (308) and the second thermal pad (304) overlap at least partially to each other in a direction perpendicular to the plane of the PCB.