POLYAMIDE COMPOSITIONS WITH HIGH HEAT PERFORMANCE

A polyamide composition comprising from 25 wt % to 90 wt % of a first polyamide comprising a non-aromatic polyamide formed from 50 wt % to 90 wt % PA66; from 10-50 wt % of a second polyamide comprising a polyamide copolymer; from 0.01-10 wt % of a first stabilizer comprising a lanthanoid-based compo...

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Bibliographische Detailangaben
Hauptverfasser: RAY, Jacob G, SPARKS, Bradley J
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A polyamide composition comprising from 25 wt % to 90 wt % of a first polyamide comprising a non-aromatic polyamide formed from 50 wt % to 90 wt % PA66; from 10-50 wt % of a second polyamide comprising a polyamide copolymer; from 0.01-10 wt % of a first stabilizer comprising a lanthanoid-based compound; from 0.01-10 wt % of a second stabilizer comprising a copper-based compound; and from 0-65 wt % filler.