DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 micro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RAVICHANDRAN, Sethumadhavan, THOMAS, Dale, WHITE, Meghann, ADAMCHUK, Jennifer
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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