DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 micro...

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Bibliographische Detailangaben
Hauptverfasser: RAVICHANDRAN, Sethumadhavan, THOMAS, Dale, WHITE, Meghann, ADAMCHUK, Jennifer
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.