POLYMERIC SUBLAYER - FORMULATION BASED ON RESINS HAVING HIGH THERMOMECHANICAL PROPERTIES (PEEK, PES, PAI, PBI, ETC) FOR REINFORCING THE MECHANICAL RESISTANCE, IN PARTICULAR TO HEAT, OF FLUORINATED COATINGS
The present invention relates to a tie sublayer of a release coating on a metal support, characterized in that it comprises: a) between 20% and 80% by weight of the total weight of the sublayer of one or more polymers selected from the group consisting of polyaryletherketones (PAEK), polyethyleneimi...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The present invention relates to a tie sublayer of a release coating on a metal support, characterized in that it comprises: a) between 20% and 80% by weight of the total weight of the sublayer of one or more polymers selected from the group consisting of polyaryletherketones (PAEK), polyethyleneimines (PEI), polyimides (PI), polyamide imides (PAI) and polybenzymidazoles (PBI), with a weight ratio PAEK: (PEI+PI+PAI+PBI) of between 1:1 and 15:1, b) at least 20%, preferably at least 25% by weight of the total weight of the sublayer of one or more polymers selected from the group consisting of phenylene polysulfides (PPS) and polyethersulfones (PES), c) less than 40%, preferably less than 30% by weight of the total weight of the sublayer of reinforcing inorganic fillers, preferably between 5% and 25% by weight, d) between 0% and 5% by weight of the total weight of the sublayer of one or more fluorocarbon or acrylic resins, e) optionally one or more pigments. |
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