PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

A printed circuit board (100), PCB, comprises a top surface (101), a bottom surface (107), a series of M castellated orifices (102) on at least one of the edges of the PCB, and a series of N conductive pads (103) on the top surface (101) connecting to the M orifices (102) at respective connection ed...

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Bibliographische Detailangaben
Hauptverfasser:	Gergis, Anthony, Saarnimo, Timo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A printed circuit board (100), PCB, comprises a top surface (101), a bottom surface (107), a series of M castellated orifices (102) on at least one of the edges of the PCB, and a series of N conductive pads (103) on the top surface (101) connecting to the M orifices (102) at respective connection edges (104), wherein M and N are integers greater than 1. Each of the pads (103) on the top surface (101) is partially covered by a respective spacer (105) such that an area between the connection edge (104) and a border (106) of a remaining pad area (103') is completely covered by the spacer (105), and the connection edge (104) and the border (106) of the remaining pad area (103') have a minimum distance of D, wherein D is a positive number. A solder leaking is prevented between the pads (103) on the top surface (101) and the castellated orifices (102) by the spacers (105).